| Products | Physical Property | Features & Uses | |||||
|---|---|---|---|---|---|---|---|
| Solid Content (wt %) | Specific Gravity (20℃) | Viscosity (20℃)(cP) | Chlorine Content (%) | ||||
| Resing Type | General Use | PO-F-1010S | 15 | 0.823 | 4.5 | 0.07 | Chip mounted & high density boards, standard type. |
| PO-F-1010K | 17 | 0.825 | 4.1 | 0.07 | Prevention of dew condensation. | ||
| ES-1061SP-2 | 15 | 0.826 | 4.0 | 0.09 | Pb-free soldering. | ||
| Lower Residue | PO-F-009M | 9 | 0.807 | 3.2 | 0.06 | Chip mounted & high density boards, lower residue, spray coating. | |
| PO-F-710 | 12 | 0.820 | 3 | 0.06 | Chip mounted & high density boards, spray coating, lower residue. | ||
| RMA | SR-209 | 12 | 0.820 | 3.7 | *RMA | Lower residue, non-cleaning, lusterless type. | |
| SR-12 | 12 | 0.818 | 3.6 | *RMA | Lower residue, non-cleaning. lustrous type. | ||
| Water-Soluble Type | General Use | WF-2050 | 20 | 0.887 | 6.7 | 2.00 | High density electronic boards. |
| Preliminary soldering of parts | WF-3041 | 46 | 1.156 | 6.1 | 0.000 | Soldering of nickel & copper based alloys, halogen-free. | |
| Tinning Flux | T-a | 1 | 0.829 | 3.0 | 0.16 | Tinning for lead wire, negligible residues. |
Es-1061sp-2 Msds
Command and conquer red alert 2 download. * The procedure is similar to chlorides and bromides test.
There are many types of flux, depending on the required application and performance. Total overdose setup. We supply a wide choice of fluxes including the resin type and water soluble type to meet every needs.
供应千住助焊剂t-1千住无铅环保助焊剂es-1061sp-2松香型助焊剂千住助焊剂总代理; ￥15.00 供应无铅助焊剂; ￥11.50 供应电路板专用无铅环保助焊剂厂家 波峰焊专用喷雾助焊剂烟小光亮; ￥82.00 供应无铅环保焊锡丝 焊锡条 助焊剂; ￥15.00. ES series Sparkle Flux is a post-flux developed for the Lead-Free soldering of PC boards. Lead-Free solder has rather poor solder wettability compared with existing Sn-Pb solder. However, solder bridges, icicles, blow holes and other problems in Lead-Free soldering can be reduced to a level equivalent to those of existing Sn-Pb solders with the. Products Solid content Chroline content Specific gravity (20°C) Remarks; ES-1061SP-2: 15%: 0.09%: 0.826: Prevents bridging of ES-1061, good finish in through-hole.
| Products | Physical Property | Features & Uses | |||||
|---|---|---|---|---|---|---|---|
| Solid Content (wt %) | Specific Gravity (20℃) | Viscosity (20℃)(cP) | Chlorine Content (%) | ||||
| Resing Type | General Use | PO-F-1010S | 15 | 0.823 | 4.5 | 0.07 | Chip mounted & high density boards, standard type. |
| PO-F-1010K | 17 | 0.825 | 4.1 | 0.07 | Prevention of dew condensation. | ||
| ES-1061SP-2 | 15 | 0.826 | 4.0 | 0.09 | Pb-free soldering. | ||
| Lower Residue | PO-F-009M | 9 | 0.807 | 3.2 | 0.06 | Chip mounted & high density boards, lower residue, spray coating. | |
| PO-F-710 | 12 | 0.820 | 3 | 0.06 | Chip mounted & high density boards, spray coating, lower residue. | ||
| RMA | SR-209 | 12 | 0.820 | 3.7 | *RMA | Lower residue, non-cleaning, lusterless type. | |
| SR-12 | 12 | 0.818 | 3.6 | *RMA | Lower residue, non-cleaning. lustrous type. | ||
| Water-Soluble Type | General Use | WF-2050 | 20 | 0.887 | 6.7 | 2.00 | High density electronic boards. |
| Preliminary soldering of parts | WF-3041 | 46 | 1.156 | 6.1 | 0.000 | Soldering of nickel & copper based alloys, halogen-free. | |
| Tinning Flux | T-a | 1 | 0.829 | 3.0 | 0.16 | Tinning for lead wire, negligible residues. |
Sparkle Flux Es-1061sp-2
* The procedure is similar to chlorides and bromides test.
Es 1061sp 250
There are many types of flux, depending on the required application and performance. Windows xp genuine activator remover tool. We supply a wide choice of fluxes including the resin type and water soluble type to meet every needs.
Es 1061sp 200
Es-1061sp-2: es-1061ps-2 es-1061sp-2性能表: ソルダーペースト(クリーム半田) 開発元：(株)テリーサ研究所 製造元：小島半田製造所: mst-lf921p: mst-lf921p: ソルダーペースト(クリーム半田) (株)光輝: s3x48-a310d: s3x48-a310d: 棒半田: 千住金属工業(株) m705e: m705e合金: 糸半田: 千住. 1．） JIS 2型の櫛形基板全面に千住金属工業製のポストフラックスES-1061SP-2を浸漬塗布する。 2．） Sn-3Ag-0.5Cu組成のはんだ合金を入れたはんだバスを260℃に加熱しておく。.
